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                        CIS

                        ASMPT provides innovative and cost-effective solutions that help you successfully meet the industry’s demand for faster and powerful devices.

                        AUTOPIA

                        Automatic Active Alignment System (for Automotive Camera Application)

                        COSMOS

                        Automatic 3D Sensing Alignment System

                        Eagle AERO

                        For High-end IC Applications

                        Lens Holder Attach System

                        IS600GS

                        Automatic Active Alignment Bonding System for Camera Module Assembly

                        Lens Holder Attach System

                        IS868LA3

                        Automatic Lens Holder Attach System

                        DI-water Cleaning System

                        ISCM868S

                        Automatic DI-Water Cleaning System

                        ISLinDA

                        Automatic Die Bonding System (12” wafer handling)

                        Ball Bonder OPTO/LED Wire Bonding Equipment

                        Harrier Xtreme

                        Dual-Head Extreme High Speed Wire Bonder

                        OPTO/LED Wire Bonding Equipment

                        iHawk Xpress XL

                        Wire Bonder

                        Ball Bonder OPTO/LED Wire Bonding Equipment

                        iHawk Xtreme

                        Wire Bonder

                        Strip Form Substrates AOI System

                        VIM300 / IS-VIM300

                        Automated Optical Inspection

                        Other Applications

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